Thermal simulations reveal staggering challenges as Imec’s 3D memory-on-GPU design targets next-generation AI data center performance | Daily Reports Online
3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced temperatures but slowed AI training by 28% Imec presented an examination of a 3D HBM-on-GPU design aimed at increasing compute density for demanding AI workloads at the 2025 IEEE…










